Instruction set with thermal opcode for high-performance...

Details Instruction set with thermal opcode for high-performance... Instruction set with thermal opcode for high-performance...

2007-12-25

2007-12-25

Perveen, Rehana (Department: 2116)

Electrical computers and digital processing systems: support

Computer power control

Reexamination Certificate

active

10981473

ABSTRACT:
A method (and system) of managing heat in an electrical circuit, includes using a thermal instruction appended to an instruction to be processed to determine a heat load associated with the instruction.

REFERENCES:
patent: 5557551 (1996-09-01), Craft
patent: 5941991 (1999-08-01), Kageshima
patent: 6397321 (2002-05-01), Yamamoto et al.
patent: 6625740 (2003-09-01), Datar et al.
patent: 2002/0065049 (2002-05-01), Chauvel et al.
patent: 2003/0182589 (2003-09-01), Tani
patent: 2005/0071701 (2005-03-01), Luick
patent: 2006/0031815 (2006-02-01), Bhagia et al.
International Preliminary Report on Patentability (Chapter 1 of the Patent Cooperation Treaty)(PCT Rule 44bis, 1(c)), May 18, 2007, International Application No. PCT/US2005/0338815, The International Bureau of WIPO.

Affiliated with

Also associated with

Rating

Instruction set with thermal opcode for high-performance... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Instruction set with thermal opcode for high-performance..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Instruction set with thermal opcode for high-performance... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3863383