Installation structure of integrated circuit devices

Details Installation structure of integrated circuit devices Installation structure of integrated circuit devices

1990-09-17

1991-09-03

Hille, Rolf

357 80, 357 81, 357 74, H01L 2312, H01L 2314

Patent

active

050459228

ABSTRACT:
An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.

REFERENCES:
patent: 4908696 (1990-03-01), Ishihara et al.
patent: 4930002 (1990-05-01), Takenaka et al.

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