Installation for floating transport and processing of substrates

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156643, 156646, 156229, 156297, 156345, 156494, 156499, B44C 122, C03C 1500, B32B 3100

Patent

active

045941297

DESCRIPTION:

BRIEF SUMMARY
The invention relates to processing installations with a double floating transport and processing of substrates.
In the process installations during processing of such substrates heat is induced by the processing medium into the substrates. Such heating takes place in particular with ion implantation, plasma etching, plasma enhanced applying of metal, plasma milling, oxidation systems etcertera. Furthermore heating occurs, in stations as part of a floating transport track, in which processing, such as cleaning and drying of the substrates, takes place.
Thereby the transporters, used preferably for double floating transport of the substrates and located in between successive process slots, function as heaters or coolers of the substrates.
The double floating transport and processing systems for the substrates are described in for instance the Dutch Patent Application Nos. 8 203 318, 8 300 443 and 8 300 649 of the applicant.
Differences in temperature in such transporters result in a considerable bowing of the passage wall-sections of these transporters, with the following disadvantages:
1. a locally critical reduction of the passage width; and
2. a variable heat transfer of the substrates to such transporters.
The installation according to the invention now is characterized in that such transporters are stretched in a longitudinal direction.
Thereby an effective use can be made of a series of hydraulic devices, which urge the mounting frames, as used for a series of transporters away, from each other.
If for the processing of the substrates use is made of a tape, to which these substrates are temporary secured, and whereby processing of both substrates and tape takes place, then the tape can also be considered as a transporter for such substrates.
Thereby such tape acts as an excellent means for heat transfer and consequently such tape is also pre-stressed to prevent a deformation thereof.
Further positive features of the installation follow from the description of the following Figures.
FIG. 1 is a top plan of the installation according to the invention, with therein positioned a series of pre-stressed transporters.
FIG. 2 is a cross section of the installation according to FIG. 1 at the transporter-arrangement.
FIG. 3 is a cross section of the installation according to FIG. 1 at the hydraulic tensioning devices.
FIG. 4 is an enlarged cross-section of the transporters, as used in the installation according to FIG. 1.
FIG. 5 is a side view of the mounting frame, on which a series of transporters are secured and pre-stressed.
FIG. 6 is a schematic of the transporter structure according to FIG. 1 without stretching forces, applied thereon.
FIG. 7 is a schematic of the transporter structure according to FIG. 6 with applied stretching forces thereon.
FIGS. 8 and 9 show a process installation, in which the combination of substrates and tape are fed through a number of transporters and process slots.
FIG. 10 is an enlarged longitudinal cross-section of two transporters with a processing slot in between.
FIG. 11 is an enlarged longitudinal cross-section of a modified module section with anisotropic plasma etching of substrates, passing through the processing slot.
In FIG. 1 the processing installation 10 is shown. Thereby the transporters 18 are by means of the hollow bolts secured to the mounting frames 12 and 14.
In these mounting frames 12 and 14 the contact areas 22 for the hydraulic tensioners 24 are located. These tensioners urge with one end against such frame and with the other end against the blocks 26, which are positioned aside the transporters 18.
In between successive transporters 18 successive processing slots 28 are located, in which processing takes place of the substrates 30, passing through.
In FIG. 2 a cross-section of the installation 10 is shown over the transporters 18. Thereby such a transporter consists of the upper section 32 and the lower section 34, with in between located the passage 36 for the substrates 30.
In the frames 12 and 14 the supply channels 38 and the discharge channels 40 f

REFERENCES:
patent: 3747393 (1973-07-01), Robra
patent: 3819286 (1974-06-01), Bianchi
patent: 3911811 (1975-10-01), Adolfsson
patent: 4252595 (1981-02-01), Yamamoto et al.
patent: 4341592 (1982-07-01), Shortes et al.

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