Inspection of masks and wafers by image dissection

Details Inspection of masks and wafers by image dissection Inspection of masks and wafers by image dissection

1975-05-05

1976-06-15

McGraw, Vincent P.

Optics: measuring and testing

Refraction testing

Prism engaging specimen

250562, 250572, 356237, 356239, G01B 1124, G01N 2132

Patent

active

039633543

ABSTRACT:
In an automated inspection procedure, corresponding elements from all the patterns lying along a row of a replicated-pattern mask or wafer are successively imaged onto a storage medium in an interleaved way. At the completion of an inspection cycle, sets of corresponding elements from all the patterns in the row are respectively arrayed in the storage medium in a side-by-side fashion.

REFERENCES:
"Surface Topography . . . Focused Lasers," Munro et al., Proceedings of Electro-Optics Systems Design Conference, May 18, 1971, pp. 311-317.
"An Automated Inspection System . . . Replicated Patterns," Sittig et al., Proceedings of the Kodak Microelectronics Seminar, Oct. 29-30, 1973, pp. 49-52.

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