Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-11-15
2010-11-30
Bella, Matthew C (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S145000, C382S146000, C382S147000, C382S148000, C382S149000
Reexamination Certificate
active
07844099
ABSTRACT:
A method for inspecting a semiconductor wafer fabricated for image sensing operation that has had a transparent protective tape layer applied to a front or active wafer surface. The method includes quantifying chip defects in the image sensor wafer that lie under the protective layer using automatic disposition equipment.
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Krywanczyk Timothy C.
Neary Timothy E.
Probstfield Erik M.
Bella Matthew C
Canale Anthony J.
International Business Machines - Corporation
Rahmjoo Mike
Scully , Scott, Murphy & Presser, P.C.
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