Inspecting apparatus for semiconductor device

Details Inspecting apparatus for semiconductor device Inspecting apparatus for semiconductor device

2007-10-16

2007-10-16

Nghiem, Michael P. (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Performance or efficiency evaluation

C702S118000

Reexamination Certificate

active

10820747

ABSTRACT:
An inspecting apparatus for a semiconductor device having a match plate; a contact module combined with the match plate, including a radiation unit contacting a semiconductor device, and a test unit pressing leads of the semiconductor device; and a thermally conductive pad installed on a contacting face of the radiation unit of the contact module, to transfer heat from the semiconductor device to the radiation unit of the contact module. The present invention provides an inspecting apparatus for semiconductor devices that improves reliability of testing for durability of semiconductor devices against heat, and minimizes damage to the semiconductor devices during testing.

REFERENCES:
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5929651 (1999-07-01), Leas et al.
patent: 6447894 (2002-09-01), Hirotsuru et al.
patent: 6720784 (2004-04-01), Martter et al.
patent: 7176704 (2007-02-01), Ryu et al.
patent: 2004/0263193 (2004-12-01), Ryu et al.
patent: 2004/0263194 (2004-12-01), Ryu et al.
patent: 2005/0012498 (2005-01-01), Lee et al.
patent: 63-283046 (1988-11-01), None
patent: 01-243561 (1989-09-01), None
patent: 4-120481 (1992-04-01), None
patent: 9-243704 (1997-09-01), None
patent: 2000-187060 (2000-07-01), None
patent: 2002-286792 (2002-10-01), None
patent: 2003-084030 (2003-03-01), None
patent: 2003-3253224 (2003-09-01), None
patent: 96-705351 (1996-10-01), None
patent: 1999-000619 (1999-01-01), None
patent: 2000-0052405 (2000-08-01), None
patent: 10-0312237 (2001-10-01), None
English Translation of KR 10-0312237, Dec. 2001.
Korean Office Action issued on Jul. 12, 2005 (Partial English Translation).
Office Action issued by the Japanese Patent Office on Jun. 12, 2007 in the corresponding Japanese Application No. 2004-101340 (2 pages).

Affiliated with

Also associated with

Rating

Inspecting apparatus for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Inspecting apparatus for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inspecting apparatus for semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3855166