Insoluble electrode for electrochemical operations on...

Details Insoluble electrode for electrochemical operations on... Insoluble electrode for electrochemical operations on...

2005-02-08

2005-02-08

Valentine, Donald R. (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Agitating or moving electrolyte during coating

C204S242000, C204S275100, C204S263000, C204S252000, C204S291000, C204S292000, C204S278000

Reexamination Certificate

active

06852209

ABSTRACT:
An apparatus and method for plating a metal onto a substrate. The apparatus generally includes an anode electrode disposed in the electrochemical cell and a cathode electrode disposed opposite the anode electrode in the electrochemical cell. The apparatus further includes an electrode lid having more than one aperture disposed between the anode electrode and the cathode electrode, the apertures configured to electrically connect the cathode electrode and the anode electrode. The method generally includes supplying an electrolyte to a plating cell having an anode electrode, a cathode electrode disposed opposite the anode electrode and an electrode lid having more than one aperture positioned between the anode electrode and the cathode electrode, wherein supplying the electrolyte includes passing the electrolyte through the more than one aperture at a rate sufficient to prevent the upward migration of dissolved gas and applying an electrical bias to the plating cell to plate a metal from the electrolyte onto the substrate.

REFERENCES:
patent: 4342635 (1982-08-01), Becker et al.
patent: 6024856 (2000-02-01), Haydu et al.
patent: 6080288 (2000-06-01), Schwartz et al.
patent: 6099712 (2000-08-01), Ritzdorf et al.
patent: 6695962 (2004-02-01), Uzoh et al.
Everplate: A Novel Production System for Copper Wafer Plating, ATOTECH (2010 4974 01-, no date.

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