Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating
Patent
1996-04-08
1999-12-07
McDonald, Rodney G.
Chemistry: electrical and wave energy
Processes and products
Vacuum arc discharge coating
20419212, 20419217, 20419232, 20419237, 438584, 438675, C23C 1434
Patent
active
059976993
ABSTRACT:
A semiconductor substrate having thereon a surface including features to be filled is placed in a vacuum chamber having a high density plasma source and a target of material to be deposited. A vacuum is drawn, and a plasma is struck in a gas by means of the high density plasma source. The substrate is then biased to cause ions from the plasma to bombard the substrate with energies sufficient to facet top corners of features on the surface of the substrate. After a desired amount of faceting has occurred, the target is biased to cause ions from the plasma to sputter the target, resulting in a plasma comprised of target material and the gas. The substrate is then biased sufficiently to provide a near perpendicular flow of ions of target material to the substrate, but at sufficiently low energy to deposit a film of the material to be deposited. The substrate bias may be held sufficiently high to prevent or reduce buildup on the facets. The substrate bias may be adjusted during the deposition process to allow increased deposition on the facets. Alternatively, the target may be biased from the start, resulting in formation of a plasma comprised of both the gas and the material to be deposited. Ions from this plasma may then be used to first facet the surface of the substrate by employing a high negative substrate bias, then to deposit a film of the material to be deposited by employing a lower negative substrate bias.
REFERENCES:
patent: 4839306 (1989-06-01), Wakamatsu
patent: 4963239 (1990-10-01), Shimamura et al.
patent: 4999096 (1991-03-01), Nihei et al.
patent: 5108570 (1992-04-01), Wang
patent: 5371042 (1994-12-01), Ong
Rossnagel et al. "Metal ion deposition from ionized magnetron sputtering discharge", J. Vac. Sci. Technol. B, vol. 12, No. 1, Feb. 1994.
McDonald Rodney G.
Micro)n Technology, Inc.
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