Insertion of electrical component within a via of a printed...

Details Insertion of electrical component within a via of a printed... Insertion of electrical component within a via of a printed...

2007-03-13

2007-03-13

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S742000, C029S852000, C174S262000, C361S763000

Reexamination Certificate

active

10991064

ABSTRACT:
A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

REFERENCES:
patent: 3078353 (1963-02-01), Skelton
patent: 3290756 (1966-12-01), Dreyer
patent: 3743890 (1973-07-01), Neu
patent: 3784878 (1974-01-01), Neu
patent: 5055966 (1991-10-01), Smith et al.

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