Inner diameter saw slicing machine

Details Inner diameter saw slicing machine Inner diameter saw slicing machine

1993-11-29

1995-05-09

Rachuba, Maurice

Abrading

Precision device or process - or with condition responsive...

451 8, 451 10, 451 67, 451 69, 125 1301, B24B 4900

Patent

active

054135214

ABSTRACT:
The open end of the nozzle 42 is positioned close to and facing the surface of the metal base 20 on the side were the portion of the semiconductor ingot is to be cut off. An electromagnetic valve 46 is provided in the passage through which compressed air is supplied to the nozzle 42. The initial position of the blade 19 is detected by the detector 50U and the counter 52 measures the distance the blade 19 travels downward from the detected position and then the comparator 56 detects the point at which the measured value matches the value set on the numeric value setting device 54. The electromagnetic valve 46 is opened to emit compressed air from the nozzle 42 after this detection, until the detection of the lower limit position of the blade 19 by the detector 50D. This compressed air travels along in the direction of the rotation of the metal base 20 to enter the notch of the partially cut portion of the semiconductor ingot 10 made by the inner circumference cutting edge 22 and to consequently blow out the liquid coolant present between the metal base 20 and the semiconductor ingot 10.

REFERENCES:
patent: 5074276 (1991-12-01), Katayama
patent: 5174270 (1992-12-01), Katayama et al.
patent: 5287843 (1994-02-01), Katayama et al.
Abstract JP2134212.
Abstract JP4138209.
Abstract JP61047644.

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