Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2005-06-07
2005-06-07
Gilliam, Barbara L. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S312000, C430S313000, C430S316000, C430S317000, C430S318000, C430S319000, C430S320000, C216S027000, C347S063000
Reexamination Certificate
active
06902867
ABSTRACT:
The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
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Hall Eric Spencer
Leis Shauna Marie
McNees Andrew Lee
Mrvos James Michael
Powers James Harold
Gilliam Barbara L.
Lexmark International Inc.
Luedeka, Neely & Graham, P. C.
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