Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2005-02-24
2008-12-16
Culbert, Roberts (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C438S021000, C029S890100
Reexamination Certificate
active
07465403
ABSTRACT:
A method of fabricating an ink jet head having a metal chamber layer includes preparing a substrate having pressure-generating elements to generate pressure to eject ink ejection. The metal chamber layer to define sidewalls of an ink flow path is then formed on the substrate. A sacrificial layer is formed to fill a region where the ink flow path is to be formed between the sidewalls defined by the metal chamber layer. A nozzle layer having nozzles corresponding to the pressure-generating elements is formed on the metal chamber layer and the sacrificial layer.
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Kim Kyong-il
Kwon Myong-jong
Park Yong-shik
Culbert Roberts
Samsung Electronics Co,. Ltd.
Stanzione & Kim LLP
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