Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-09-16
2009-11-10
Deo, Duy-Vu N (Department: 1792)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S285100, C430S287100
Reexamination Certificate
active
07615334
ABSTRACT:
Provided are an ink composition for an etching resist, a method of forming an etching resist pattern using the ink composition, and a method of forming a microchannel using the ink composition. The ink composition is suitable for forming a micro pattern due to its poor spreading on the substrate and is suitable for etching-resist for copper of a printed circuit board and deep etching a stainless steel substrate due to its excellent chemical properties that allow it to resist an etching solution.
REFERENCES:
patent: 4564580 (1986-01-01), Ichimura et al.
patent: 5270368 (1993-12-01), Lent et al.
patent: 5422222 (1995-06-01), Akaki et al.
patent: 5741621 (1998-04-01), Kempf et al.
patent: 6040002 (2000-03-01), Noguchi et al.
patent: 6136507 (2000-10-01), Morigaki
patent: 6150430 (2000-11-01), Walters et al.
patent: 2005/0014004 (2005-01-01), King et al.
patent: 2005/0170094 (2005-08-01), Roth et al.
patent: 1230568 (1999-10-01), None
patent: 56-66089 (1981-04-01), None
patent: 56-66089 (1981-06-01), None
patent: 62-181490 (1987-08-01), None
patent: 04-141662 (1992-05-01), None
patent: 08-211602 (1996-08-01), None
patent: 09-008436 (1997-01-01), None
patent: 11-172177 (1999-06-01), None
patent: 11-172179 (1999-06-01), None
patent: 11-181050 (1999-07-01), None
patent: 11-258797 (1999-09-01), None
patent: 11258797 (1999-09-01), None
patent: 2002-064262 (2002-02-01), None
patent: 2003-142801 (2003-05-01), None
patent: WO 01/11426 (2001-02-01), None
Kim Hyun-sik
Kim Joon Hyung
Kwon Youngwoon
Seo Jung Hyun
Deo Duy-Vu N
LG Chem Ltd.
McKenna Long & Aldridge LLP
LandOfFree
Ink composition for etching resist, method of forming... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ink composition for etching resist, method of forming..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ink composition for etching resist, method of forming... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4093285