Injection molded metal bonding tray for integrated circuit...

Details Injection molded metal bonding tray for integrated circuit... Injection molded metal bonding tray for integrated circuit...

2007-02-27

2007-02-27

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C385S135000, C257SE23180, C257SE23194

Reexamination Certificate

active

10984042

ABSTRACT:
An injection molded metal bonding tray may be utilized in the fabrication of integrated circuit devices. In one embodiment, a substrate of an integrated circuit device is placed in a pocket of an injection molded metal bonding tray. A plurality of conductors is placed on the substrate and the conductors are bonded to the substrate in an infrared reflow oven, for example. Other embodiments are described and claimed.

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