Initial ball forming method for wire bonding wire and wire...

Details Initial ball forming method for wire bonding wire and wire... Initial ball forming method for wire bonding wire and wire...

2005-04-05

2005-04-05

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S004500, C219S076130

Reexamination Certificate

active

06874673

ABSTRACT:
A wire bonding apparatus having a capillary with a wire passing therethrough; and when the switch of a first direct-current high-voltage power supply is switched ON, a space discharge takes place between the tip end of the wire and a torch electrode, and the tip end of the wire is melted by the discharge, making a ball-form ball base. When the switch of a second high-voltage power supply is switched ON, a space discharge takes place between a pair of dissociated gas forming electrodes made of a coating material whose melting point is lower than that of the wire, so that a dissociated gas containing tin ions is formed. The ball base is positioned inside the dissociated gas, and thus, tin adheres to the surface of the ball base, and an initial ball with a low-melting-point coating material adhering to the surface is formed.

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