Inhibited composition and method for stripping tin, lead or tin-

Details Inhibited composition and method for stripping tin, lead or tin- Inhibited composition and method for stripping tin, lead or tin-

1989-07-28

1990-05-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156664, 156902, 252 794, B44C 122, C23F 100, C03C 1500, C03C 2506

Patent

active

049215710

ABSTRACT:
A composition for stripping tin, lead or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, an inorganic nitrate, preferably ferric nitrate, and an inhibitor component. The composition effects rapid stripping without any appreciable formation of sludge or precipitate or suspended particles, and without any substantial attack on the underlying copper surface.

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