Ingot slicing method and apparatus therefor

Details Ingot slicing method and apparatus therefor Ingot slicing method and apparatus therefor

1998-03-16

2000-05-23

Eley, Timothy V.

Stone working

Sawing

Reciprocating

125 21, B28D 106, B28D 108

Patent

active

060654619

ABSTRACT:
An ingot slicing method and apparatus is disclosed. An ingot is sliced by a wire saw having a wire wound over a plurality of grooved rollers at a predetermined pitch. The ingot is secured to a holder and then pressed onto the wire which is carried along one direction or reciprocatively carried over a plurality of grooved rollers. The holder is shifted along one direction parallel to an axis of the grooved rollers until about a half section of the ingot is sliced. The holder is shifted along an inverse direction during slicing the remainder of the ingot. Thus, a wafer sliced off the ingot has a bowed shape corresponding to a locus of movement of the holder.

REFERENCES:
patent: 5735258 (1998-04-01), Okuno et al.
patent: 5778869 (1998-07-01), Toyama
patent: 5842462 (1998-12-01), Schmid et al.
patent: 5857454 (1999-01-01), Shibaoka
patent: 5875770 (1999-03-01), Fukunaga

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