Inductor integrated chip

Details Inductor integrated chip Inductor integrated chip

2006-06-23

2009-11-10

Rose, Kiesha L (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S704000, C257S713000, C257S659000, C257S660000, C257S698000, C257S778000, C257S780000, C257S738000, C257S685000, C257S678000, C257S710000, C257S707000, C257SE23001, C257SE23004, C438S121000, C438S125000, C438S124000, C438S126000

Reexamination Certificate

active

07615842

ABSTRACT:
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the surface of the wafer and coupled to a first end of the inductor; a packaging wafer connected to the surface of the wafer and packaging the inductor and the circuit element; and a connecting electrode formed on the packaging wafer and connected to a second end of the inductor. The method includes forming an inductor and a circuit element on a surface of a wafer, wherein the circuit element is coupled to a first end of the inductor; forming a connecting electrode on a packaging wafer; and packaging the inductor and the circuit element by joining the wafer and the packaging wafer so as to connect the connecting electrode with a second end of the inductor.

REFERENCES:
patent: 6028354 (2000-02-01), Hoffman
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6673697 (2004-01-01), Ma et al.
patent: 6710681 (2004-03-01), Figueredo et al.

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