Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
1999-03-10
2001-02-27
Williams, Alexander O. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S784000, C257S728000, C257S786000, C257S724000, C257S725000, C257S528000, C330S269000, C330S206000, C330S005000, C330S286000, C336S200000
Reexamination Certificate
active
06194774
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an inductor, and more particularly, to a high-quality inductor which can be built using bonding wires attached to a substrate.
2. Description of the Related Art
A conventional on-chip inductor has various patterns, including a spiral inductor, a meandering line inductor, pairs of such inductors and the like. Placing metal on top of chips can increase the inductance and mutual inductance of such inductors. However, since an on-chip inductor typically has a large parasitic capacitance with a substrate having a high conductance, e.g., a silicon substrate, the conventional on-chip inductor has a very low quality factor. Also, it is quite difficult to fabricate an on-chip inductor having a high quality factor using conventional integrated circuit manufacturing processes. Accordingly, an on-chip inductor having a high quality factor is sought.
SUMMARY OF THE INVENTION
In accordance with an embodiment of the invention, an inductor includes a substrate such as a silicon or other semiconductor substrate and pairs of pads formed on the substrate at predetermined intervals. The pads in a pair are spaced apart by a predetermined distance. Each pair of pads has an corresponding bonding wire connected between the pads constituting the pair, and metal lines on the substrate connect a pad from each pair of pads to a pad in the next pair so that the pairs of pads, the metal lines, and the bonding wires form a current path.
REFERENCES:
patent: 3614554 (1971-10-01), Shield et al.
patent: 4446445 (1984-05-01), Apel
patent: 5024966 (1991-06-01), Dietrich et al.
patent: 5173672 (1992-12-01), Heine
patent: 5221984 (1993-06-01), Furuyama et al.
patent: 5321299 (1994-06-01), Ohkawa et al.
patent: 5376902 (1994-12-01), Bockelman et al.
patent: 5378869 (1995-01-01), Marrs et al.
patent: 5394008 (1995-02-01), Ito et al.
patent: 5519233 (1996-05-01), Fukasawa
patent: 5572180 (1996-11-01), Huang et al.
patent: 5576680 (1996-11-01), Ling
patent: 5639989 (1997-06-01), Higgins, III
patent: 5710068 (1998-01-01), Hill
patent: 5736749 (1998-04-01), Xie
patent: 5744869 (1998-04-01), Root
patent: 5767563 (1998-06-01), Imam et al.
patent: 5793096 (1998-08-01), Yu et al.
patent: 5849355 (1998-12-01), McHenry
patent: 5877667 (1999-03-01), Wollesen
patent: 5880517 (1999-03-01), Petrosky
patent: 5886393 (1999-03-01), Merrill et al.
patent: 5912997 (1999-06-01), Bischel et al.
patent: 5920067 (1999-07-01), Cresswell et al.
patent: 5929636 (1999-07-01), Torok et al.
patent: 5966063 (1999-10-01), Sato et al.
patent: 5973567 (1999-10-01), Heal et al.
Millers David
Samsung Electronics Co,. Ltd.
Skjerven Morrill & MacPherson LLP
Williams Alexander O.
LandOfFree
Inductor including bonding wires does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Inductor including bonding wires, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inductor including bonding wires will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2601810