Inductor embedded in substrate, manufacturing method...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S603230, C029S603250, C029S606000, C029S846000, C029S852000, C360S317000, C336S200000

Reexamination Certificate

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07963021

ABSTRACT:
An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.

REFERENCES:
patent: 5729887 (1998-03-01), Irie
patent: 6603641 (2003-08-01), Sasaki
patent: 7012327 (2006-03-01), Huff et al.
patent: 2004/0016995 (2004-01-01), Kuo et al.
patent: 2005/0275497 (2005-12-01), Ramadan et al.
patent: 10-2001-0076787 (2001-08-01), None

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