Inductor and capacitor formed of build-up vias

Details Inductor and capacitor formed of build-up vias Inductor and capacitor formed of build-up vias

2007-07-24

2007-07-24

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Strip type

C333S033000

Reexamination Certificate

active

11186859

ABSTRACT:
An inductor and capacitor implemented with build-up vias. The inductor and capacitor comprise a conductor plane, a dielectric layer, an inductor/capacitor inducing build-up via and a conductor layer. There is a conducting material in the inductor/capacitor inducing build-up via and a fist end thereof is in contact with the conductor plane. The length of the inductor inducing build-up via is larger than one fourth of a signal wavelength while the length of the conductor inducing build-up via is smaller than one fourth of a signal wavelength.

REFERENCES:
patent: 5451917 (1995-09-01), Yamamoto et al.
patent: 5886597 (1999-03-01), Riad
patent: 6091310 (2000-07-01), Utsumi et al.

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