Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate
2011-03-08
2011-03-08
Fulk, Steven J (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
C438S199000, C438S275000, C257S369000, C257SE21638
Reexamination Certificate
active
07902058
ABSTRACT:
In a metal gate replacement process, strain may be selectively induced in the channels of NMOS and PMOS transistors. For example, a material having a higher coefficient of thermal expansion than the substrate may be used to form the gate electrodes of PMOS transistors. A material with a lower coefficient of thermal expansion than that of the substrate may be used to form the gate electrodes of NMOS transistors.
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Brask Justin K.
Chau Robert S.
Datta Suman
Doczy Mark L.
Doyle Brian S.
Fulk Steven J
Intel Corporation
Trop Pruner & Hu P.C.
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