Individual selective rework of defective BGA solder balls

Details Individual selective rework of defective BGA solder balls Individual selective rework of defective BGA solder balls

2005-06-28

2005-06-28

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000

Reexamination Certificate

active

06911388

ABSTRACT:
A method for reworking a ball grid array (BGA) of solder balls is provided including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

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