Indicating adhesion status between substrate and encapsulant of

Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2064591, B65D 8500

Patent

active

060681292

ABSTRACT:
An indicator based on the present invention for indicating the adhesion status between a substrate and the encapsulation layer of a packaged electronic device is characterized in that at least one indicating pattern and one indicating region surrounding the indicating pattern are formed on the substrate, the adhesion between the indicating pattern and the encapsulant is very good while that between the indicating region and the encapsulant is relatively poor, both the indicating pattern and the indicating region are covered by molding encapsulant which is stripped off when having become hardening, thereby the status of the indicating pattern appearing after stripping off the encapsulant can indicate the adhesion quality (integration quality) between the encapsulation layer and the substrate. The indicator realizes a non-destructive quality checking process in which each electronic device can be checked to achieve one hundred percent of quality control.

REFERENCES:
patent: 5287962 (1994-02-01), Nomi et al.
patent: 5727684 (1998-03-01), Webb et al.
patent: 5896990 (1999-04-01), Barzana

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Indicating adhesion status between substrate and encapsulant of does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Indicating adhesion status between substrate and encapsulant of , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Indicating adhesion status between substrate and encapsulant of will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1904314

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.