Increasing dielectric constant in local regions for the...

Semiconductor device manufacturing: process – Making passive device – Trench capacitor

Reexamination Certificate

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C257SE21008

Reexamination Certificate

active

07553736

ABSTRACT:
A method for increasing capacitances of capacitors and the resulting integrated structure are provided. The method includes providing a substrate, forming a low-k dielectric layer over the substrate wherein the low-k dielectric layer includes a capacitor region and a non-capacitor region, forming a capacitor in the capacitor region, forming a masking layer which masks the non-capacitor region while leaving the capacitor region exposed, performing a local treatment to increase a k value of the low-k dielectric layer in the capacitor region, and removing the masking layer.

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patent: WO2005/062348 (2005-07-01), None
Wang et al., “Effect of oxygen plasma treatment on low dielectric constant carbon-doped silicon oxide thin films”, Sep. 12, 2004, Thin Solid Films, vol. 473, pp. 132-136.

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