In-situ real-time monitoring technique and apparatus for...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant

Reexamination Certificate

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Reexamination Certificate

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07037403

ABSTRACT:
A technique and apparatus is disclosed for the optical monitoring and measurement of a thin film (or small region on a surface) undergoing thickness or other changes while it is rotating. An optical signal is routed from the monitored area through the axis of rotation and decoupled from the monitored rotating area. The signal can then be analyzed to determine an endpoint to the planarization process. The invention utilizes interferometric and spectrophotometric optical measurement techniques for the in situ, real-time endpoint control of chemical-mechanical polishing planarization in the fabrication of semiconductor or various electrical devices.

REFERENCES:
patent: 2578859 (1951-12-01), Teeple et al.
patent: 2973686 (1961-03-01), Dreyfus et al.
patent: 3510667 (1970-05-01), Cleveland et al.
patent: 3623813 (1971-11-01), Haeman
patent: 3630795 (1971-12-01), Vorie
patent: 3869211 (1975-03-01), Wantanabe et al.
patent: 3986777 (1976-10-01), Roll
patent: 4272924 (1981-06-01), Masuko et al.
patent: 4328068 (1982-05-01), Curtis
patent: 4398791 (1983-08-01), Dorsey
patent: 4436367 (1984-03-01), Lewis et al.
patent: 4529986 (1985-07-01), d'Auria et al.
patent: 4547073 (1985-10-01), Kugimiya
patent: 4569717 (1986-02-01), Ohgami et al.
patent: 4618262 (1986-10-01), Maydan et al.
patent: 4672200 (1987-06-01), Claypool et al.
patent: 4680084 (1987-07-01), Heimann et al.
patent: 4711516 (1987-12-01), Graber
patent: 4713140 (1987-12-01), Tien
patent: 4776695 (1988-10-01), van Pham et al.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4851311 (1989-07-01), Millis et al.
patent: 4879258 (1989-11-01), Fisher
patent: 4929828 (1990-05-01), Claypool
patent: 4948259 (1990-08-01), Enke et al.
patent: 4975141 (1990-12-01), Greco et al.
patent: 4998021 (1991-03-01), Mimasaka
patent: 4999509 (1991-03-01), Wada et al.
patent: 5020283 (1991-06-01), Tuttle
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5046849 (1991-09-01), Severin et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081421 (1992-01-01), Miller et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5097430 (1992-03-01), Birang
patent: 5120966 (1992-06-01), Kondo
patent: 5132617 (1992-07-01), Leach et al.
patent: 5196353 (1993-03-01), Sandhu et al.
patent: 5219787 (1993-06-01), Carey et al.
patent: 5234868 (1993-08-01), Cote
patent: 5242524 (1993-09-01), Leach et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5265378 (1993-11-01), Rostoker
patent: 5294289 (1994-03-01), Heinz et al.
patent: 5297364 (1994-03-01), Tuttle
patent: 5308438 (1994-05-01), Cote et al.
patent: 5308447 (1994-05-01), Lewis et al.
patent: 5321304 (1994-06-01), Rostoker
patent: 5329734 (1994-07-01), Yu
patent: 5332467 (1994-07-01), Sune et al.
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5394655 (1995-03-01), Allen et al.
patent: 5413651 (1995-05-01), Otruba
patent: 5413941 (1995-05-01), Koos et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5483568 (1996-01-01), Yano et al.
patent: 5499733 (1996-03-01), Litvak
patent: 5605760 (1997-02-01), Roberts
patent: 5893796 (1999-04-01), Birang et al.
patent: 5910043 (1999-06-01), Manzonic et al.
patent: 5948259 (1999-09-01), Deguitre et al.
patent: 5949927 (1999-09-01), Tang
patent: 5964643 (1999-10-01), Birang et al.
patent: 6045439 (2000-04-01), Birang et al.
patent: 6280290 (2001-08-01), Birang et al.
patent: 6413867 (2002-07-01), Sarfaty et al.
patent: 625573 (1961-08-01), None
patent: 0 352 740 (1990-01-01), None
patent: 0 738 561 (1996-03-01), None
patent: 1.075.634 (1954-10-01), None
patent: 57-138575 (1982-08-01), None
patent: 58-4353 (1983-01-01), None
patent: 59-57215 (1984-04-01), None
patent: 59-57215 (1984-04-01), None
patent: 59-74635 (1984-04-01), None
patent: 60-79304 (1985-05-01), None
patent: 61-164773 (1986-07-01), None
patent: 02015625 (1990-01-01), None
patent: H02-86128 (1990-07-01), None
patent: 02086128 (1990-07-01), None
patent: 2-222533 (1990-09-01), None
patent: 02222533 (1990-09-01), None
patent: 3-234467 (1991-10-01), None
patent: H05-69311 (1993-03-01), None
patent: 5-138531 (1993-06-01), None
patent: 5-309558 (1993-11-01), None
patent: 7-52032 (1995-02-01), None
patent: 92-20600 (1992-11-01), None
patent: WO 93/20976 (1993-10-01), None
A. Novembre, et al. BACUS—9th Annual Symposium, “Automated Process Control of Poly(Butene-1-Sulfone) PBS Resist Development,” (Sep. 1989) pp. 139-144.
A. Novembre, et al. SPIE, vol. 1087, Integrated Circuit Metrology, Inspection, and Process Control III (1989) An In Situ Interferometric Analysis of Resist Development on Photomask Substrates, pp. 460-468.
A. Novembre, et al. SPIE, vol. 1809, 12th Annual BACUS Symposium (1992), Initial manufacturing performance of an actively controlled PBS resist development process (pp. 76-84.
Wallace T.Y. Tang, U.S. Appl. No. 11/043,486, filed Jan. 25, 2005, 27 pp.
Anonymous, “End-Point Detection of Oxide Polishing and Planarization of Semiconductor Devices,”Research Disclosure, 1992, No. 340, Kenneth Mason Publications Ltd., England.
Carlotta et al., “Effect of thickness and surface treatment on silicon wafer reflectance,”Solar Energy Materials and Solar Cells, 1992, 27:265-272.
Henck, “In situreal-time ellipsometry for film thickness measurement and control,”J. Vac. Sci. Technol. A., 1992, 10(4):934-938.
Jurczyk et al., “Process Detection System,” IBM Technical Disclosure Bulletin, 1975, 18(6):1867-1870.
Nakamura et al., “Mirror Polishing of Silicon Wafters (4thReport),”—Development of Bowl Feed and Double Side Polishing Machine with In-situ Thickness Monitoring of Silicon Wafers,JSPE, pp. 129-134.
Sautter et al., “Development process control and optimization utilizing and end point monitor,”SPIE, 1989, 1087:312-316.

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