Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1995-05-25
1997-06-03
Quach, T. N.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438789, 438763, 438632, H01L 21283, H01L 2131
Patent
active
056354258
ABSTRACT:
A method for avoiding separation between a TEOS layer and the underlying dielectric layer is described, A first dielectric layer is deposited over semiconductor device structures in and on a semiconductor substrate and planarized. A conducting layer is deposited overlying the first dielectric layer and patterned thereby exposing portions of the first dielectric layer, The exposed portions of the first dielectric layer are treated with N.sub.2 plasma, A second dielectric layer is deposited overlying the patterned conducting layer and the exposed portions of the first dielectric layer, The treating of the exposed portions of the first dielectric layer with N.sub.2 plasma improves adhesion between the second dielectric layer and the exposed portions of the first dielectric layer,
REFERENCES:
patent: 4872947 (1989-10-01), Wang et al.
patent: 4894352 (1990-01-01), Lane et al.
patent: 5013691 (1991-05-01), Lory et al.
patent: 5219774 (1993-06-01), Vasche
patent: 5334554 (1994-08-01), Lin et al.
patent: 5356722 (1994-10-01), Nguyen et al.
Wolf, S., Silicon Processing, vol. 2, 1990, Lattice Press, pp. 199-204, 224-236.
"Improvement of Gap-Filling Property of O.sub.3 -tetraethylorthosilicate (TEOS) Film by Ethanol Surface Treatment", Japan Journal of Applied Physics 32 (1993) Pt. 2 No. 1A/B pp. L110-L112.
Industrial Technology Research Institute
Pike Rosemary L. S.
Quach T. N.
Saile George O.
LandOfFree
In-situ N.sub.2 plasma treatment for PE TEOS oxide deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with In-situ N.sub.2 plasma treatment for PE TEOS oxide deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-situ N.sub.2 plasma treatment for PE TEOS oxide deposition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-391271