In situ feature height measurement

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S041000, C451S285000

Reexamination Certificate

active

06976901

ABSTRACT:
Embodiments of the invention provide methods and apparatus for in situ feature height measurement of an object being planarized. In one embodiment, a method of planarizing an object comprises polishing a surface of the object to be planarized using a polishing pad having a cavity; and directing an incident light from the cavity of the polishing pad to optically measure feature heights of surface features on the surface of the object to obtain measurement data during the polishing of the surface using the polishing pad. The feature heights are relative height differences of the features measured by directing the incident light at the surface of the object from the cavity and observing a reflected light intensity of a reflected light from the features on the surface to the cavity.

REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5643060 (1997-07-01), Sandhu et al.
patent: 5664987 (1997-09-01), Renteln
patent: 5792709 (1998-08-01), Robinson et al.
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5938504 (1999-08-01), Talieh
patent: 5949927 (1999-09-01), Tang
patent: 5953115 (1999-09-01), Landers et al.
patent: 6000996 (1999-12-01), Fujiwara
patent: 6022807 (2000-02-01), Lindsey, Jr. et al.
patent: 6071177 (2000-06-01), Lin et al.
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6190234 (2001-02-01), Swedek et al.
patent: 6224460 (2001-05-01), Dunton et al.
patent: 6280289 (2001-08-01), Wiswesser et al.
patent: 6296548 (2001-10-01), Wiswesser et al.
patent: 6383058 (2002-05-01), Birang et al.
patent: 6485354 (2002-11-01), Wolf
patent: 6506097 (2003-01-01), Adams et al.
“The Ellipsometer”; http://ece-www.colorado.edu/.about.bart/book/ellipsom.htm.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

In situ feature height measurement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with In situ feature height measurement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In situ feature height measurement will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3522652

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.