Metal fusion bonding – With means to cut or separate work – filler – flux – or product
Patent
1994-11-21
1996-09-10
Heinrich, Samuel M.
Metal fusion bonding
With means to cut or separate work, filler, flux, or product
228264, 228119, H05K 334, B23K 300
Patent
active
055537669
ABSTRACT:
Deformation of a lifting ring of bimetallic structure or memory metal is matched to a solder softening or melting temperature to apply forces to lift a chip from a supporting structure, such as a substrate or multi-chip module, only when the solder connections between the chip and the supporting structure are softened or melted. The temperature of the chip, module and solder connections there between is achieved in a commercially available box oven or belt furnace or the like and results in much reduced internal chip temperatures and thermal gradients within the chip as compared to known hot chip removal processes. Tensile and/or shear forces at solder connections and chip and substrate contacts are much reduced in comparison with known cold chip removal processes. Accordingly, the process is repeatable at will without significant damage to or alteration of electrical characteristics of the chip or substrate.
REFERENCES:
patent: 4586252 (1986-05-01), Faticanti
patent: 4767047 (1988-08-01), Todd et al.
patent: 4894910 (1990-01-01), Reimer et al.
patent: 4962878 (1990-10-01), Kent
patent: 5058856 (1991-10-01), Gordon et al.
patent: 5198066 (1993-03-01), Cederstr om
IBM Technical Disclosure Bulletin, "Memory Wire Chip Removal Fixture", No. 10A, Mar. 1990, p. 195.
IBM Technical Disclosure Bulletin, "Interposer Remove Tool", vol. 35, No. 4A, Sep. 1992, pp. 25-27.
IBM Technical Disclosure Bulletin, vol. 16, No. 9, Feb. 1974, R. Noth et al, "Multilayer Substrate Repair Method", pp. 2789-2790.
IBM Technical Disclosure Bulletin, vol. 29, No. 12, May 1987, G. Galyon et al, "Chip With Lengthened Solder Joints Using Shape Memory Alloy", pp. 5213-5214.
IBM Technical Disclosure Bulletin, vol. 33, No. 10A, Mar. 1991, K. Ledestri et al., "Bimetal Component Removal", pp. 43-44.
Jackson Raymond A.
Lidestri Kathleen A.
Linnell David C.
Master Raj N.
Heinrich Samuel M.
International Business Machines - Corporation
Murray Susan M.
LandOfFree
In-situ device removal for multi-chip modules does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with In-situ device removal for multi-chip modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-situ device removal for multi-chip modules will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1314335