Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-01-25
1988-12-27
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156636, 156637, 156645, 156662, 156345, 156903, H01L 21306, B44C 122
Patent
active
047938951
ABSTRACT:
An apparatus and method for monitoring the conductivity of a semiconductor wafer during the course of a polishing process. A polishing pad that contacts the wafer has an active electrode and at least one passive electrode, both of which are embedded in the polishing pad. A detecting device is connected to the active and passive electrodes for monitoring the current between the electrodes as the wafer is lapped by the polishing pad. The etch endpoint of the wafer is determined as a function of the magnitude of the current flow.
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IBM Technical Disclosure Bulletin, vol. 19, No. 4, Sep. 1976, by J. R. Skobern, "Nodule Removal Tool".
Kaanta Carter W.
Leach Michael A.
IBM Corporation
Powell William A.
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