In-plane sensor and method for making same

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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C073S514320

Reexamination Certificate

active

07989247

ABSTRACT:
According to the present invention, an in-plane sensor comprises: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end which is unsupported; and a movable structure including at least one mass body and an extending finger connected to each other; wherein the supported end of the fixed finger is closer to the mass body than the suspended end is.

REFERENCES:
patent: 6030850 (2000-02-01), Kurle et al.
patent: 6712983 (2004-03-01), Zhao et al.
patent: 7666702 (2010-02-01), Li et al.

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