Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-07-11
2006-07-11
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S118000
Reexamination Certificate
active
07074646
ABSTRACT:
An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.
REFERENCES:
patent: 4043485 (1977-08-01), Tippetts
patent: 4960485 (1990-10-01), Ichinose et al.
patent: 5871610 (1999-02-01), Minohoshi et al.
patent: 6017776 (2000-01-01), Jiang et al.
patent: 6080931 (2000-06-01), Park et al.
patent: 6088474 (2000-07-01), Dudasko et al.
patent: 6188127 (2001-02-01), Senba et al.
patent: 6223800 (2001-05-01), Kim et al.
patent: 6524891 (2003-02-01), Jiang
patent: 6621157 (2003-09-01), Wirz et al.
patent: 6742561 (2004-06-01), Nam et al.
patent: 05-283608 (1993-10-01), None
patent: 08-070079 (1996-03-01), None
patent: 08-279591 (1996-10-01), None
patent: 10-172997 (1998-06-01), None
patent: 10-335577 (1998-12-01), None
patent: 2001-028422 (2001-01-01), None
patent: 2001-185651 (2001-07-01), None
patent: 1998-022842 (1998-07-01), None
patent: 2000-0007325 (2000-02-01), None
English language of Abstract for Japanese Patent Publication No. 08-070079.
English language of Abstract for Japanese Patent Publication No. 05-283608.
English language of Abstract for Japanese Patent Publication No. 2001-028422.
English language of Abstract for Japanese Patent Publication No. 2001-185651.
English language of Abstract for Japanese Patent Publication No. 08-279591.
English language of Abstract for Japanese Patent Publication No. 10-172997.
English language of Abstract for Japanese Patent Publication No. 10-335577.
English language of Abstract for Korea Patent Publication No. 1998-022842.
English language of Abstract for Korea Patent Publication No. 2000-0007325.
Cho Kyoung-Bok
Hong Sung-Bok
Kim Hyun-Ho
Sun Young-Kyun
Geyer Scott B.
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
LandOfFree
In-line die attaching and curing apparatus for a multi-chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with In-line die attaching and curing apparatus for a multi-chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In-line die attaching and curing apparatus for a multi-chip... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3573968