Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means
Reexamination Certificate
2005-03-08
2005-03-08
Tran, Thien F (Department: 2811)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With work feeding or handling means
C156S578000
Reexamination Certificate
active
06863109
ABSTRACT:
An in-line die attaching and curing apparatus for a multi-chip package (MCP) comprises at least one die attaching apparatus and at least one snap-cure apparatus. In one embodiment, the die attaching apparatus comprises a loader, an index rail, a transfer gripper, a wafer loader, a chip alignment table, an adhesive applying device and an apparatus for placing a device on a chip mounting area. The die attaching apparatus further comprises a UV radiation device and a vision camera. The adhesive curing apparatus comprises a frame providing unit being provided with the chip mounting frame from the index rail, a plurality of heating zones, each having a heating means, the heating means operable to raise and/or lower the temperature condition of the heating zones, a frame discharging unit discharging the chip mounting frame, and frame transfer means transferring the chip mounting frame from the frame providing unit to the frame discharging unit through the heating zones.
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Cho Kyoung-Bok
Hong Sung-Bok
Kim Hyun-Ho
Sun Young-Kyun
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
Tran Thien F
LandOfFree
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