Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1994-06-02
1996-08-27
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257746, 257747, 257794, 257697, D01L 2348
Patent
active
055504035
ABSTRACT:
An integrated circuit package, and integrated circuit assembly having such a package, includes a base portion and a cover portion which cooperatively enclose an integrated circuit chip. The base and cover portions are formed of composite material and have matching coefficients of thermal expansion. Because the base and cover portions each match the other's thermal expansions and contractions, no stresses are generated in the package from heating and cooling during and following operation of the integrated circuit chip, and no such thermally produced physical stresses are transferred to the circuit chip to shorten its life. A version of the package includes plural lamina, and may include facial metallic coating layers on the lamina for shielding, electromagnetic shielding, and electrical interconnection of the integrated circuit chip. Another version of the package utilizes the facial metallic coating layers to join portions of the package by soldering.
REFERENCES:
patent: 4139859 (1979-02-01), Lewis et al.
patent: 4142203 (1979-02-01), Dietz
patent: 4355463 (1982-10-01), Burns
patent: 4649415 (1987-03-01), Hebert
patent: 4656499 (1987-04-01), Butt
patent: 4680617 (1987-07-01), Ross
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4691255 (1987-09-01), Murakami et al.
patent: 4833102 (1989-05-01), Byrne et al.
patent: 4864384 (1989-09-01), Boudot et al.
patent: 4868638 (1989-09-01), Hirata et al.
patent: 4935581 (1990-06-01), Komathu
patent: 5070041 (1991-12-01), Katayama et al.
patent: 5073425 (1991-12-01), Dees, Jr. et al.
patent: 5103293 (1992-04-01), Bonajino et al.
patent: 5242755 (1993-09-01), Keller et al.
patent: 5291062 (1994-03-01), Higgins
Clark Jhihan
Crane Sara W.
LSI Logic Corporation
LandOfFree
Improved laminate package for an integrated circuit and integrat does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Improved laminate package for an integrated circuit and integrat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Improved laminate package for an integrated circuit and integrat will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1057895