Implanting with improved uniformity and angle control on...

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S492200, C250S3960ML, C250S492300

Reexamination Certificate

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07812325

ABSTRACT:
A system, method and program product for improving uniformity and angle control wafers being implanted. A system is provided that includes an end station for positioning a wafer being implanted, comprising: a platen for holding the wafer, wherein the platen is rotatable to provide wafer rotation; a housing for holding the platen, wherein the housing is rotatable about a first orthogonal axis to provide a first type of wafer tilt; a structure for supporting the housing, wherein the structure is rotatable about a second orthogonal axis to provide a second type of wafer tilt; and a control system which, during an implant process of the wafer, causes wafer rotation, the first type of wafer tilt, and the second type of wafer tilt.

REFERENCES:
patent: 6437350 (2002-08-01), Olson et al.
patent: 6903348 (2005-06-01), Jang et al.
patent: 6992309 (2006-01-01), Petry et al.
patent: 2005/0251279 (2005-11-01), Ray
patent: 2006/0145095 (2006-07-01), Olson et al.
patent: 2008/0096359 (2008-04-01), Gupta et al.

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