Implant enhancement of titanium silicidation

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

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438683, H01L 213205, H01L 214763

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active

060048719

ABSTRACT:
A method of forming silicided narrow (i.e., sub-0.25 .mu.m) polysilicon lines. A layer of titanium is deposited over a semiconductor body having polysilicon lines formed thereon Either before or after the titanium deposition and before the react step, an implant is performed using a gas that will not poison the subsequent silicidation reaction. Exemplary gases include the noble element gases such as argon, krypton, xenon, and neon. The titanium is then reacted with the polysilicon lines to form titanium silicide. The gas implant causes the C49 grain size of the titanium silicide to be reduced, which makes the transformation to the C54 phase easier. Finally, an anneal is performed to transform the titanium silicide from the C49 phase to the C54 phase.

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"A Ti Salicide Process for 0.10.mu. m Gate Length CMOS Technology", 1996 Symposium on VLSI Technology Digest of Technical Papers, pp. 14-15 (Jorge A. Kittl, Qi-Zhong Hong, Mark Rodder, Douglas A. Prinslow and George R. Misium).

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