Impedance controlled test fixture for multi-lead surface mounted

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

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Details

257785, 324762, 361776, H01L 2358

Patent

active

057341761

ABSTRACT:
A test fixture for testing an integrated circuit having leads. The test fixture includes a substrate with top and bottom surfaces and holes extending from the top to the bottom surface. The integrated circuit is mounted on the top surface with each lead located above each hole. Contact flippers are located on the top surface of the substrate, with the contact flippers extending between the leads and the holes. Shuttle springs are located along the bottom surface and extend across the holes. Shuttles are inserted into each hole so that upon contact by the leads against the contact flippers, the shuttles move downward and against the upward pressure from the shuttle springs to provide a resilient connection between the test fixture and the integrated circuit.

REFERENCES:
patent: 4922376 (1990-05-01), Pommer et al.
patent: 5434452 (1995-07-01), Higgins, III
"Test Socket Performance Handbook" 1st Edition by David A. Johnson and David L. Senum (1994).
"Membrane Probe Speeds Digital and RF IC Testing", Microwave & RF, Jan. 1995, pp. 135-139.

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