Impact-free wire bonding of microelectronic devices

Details Impact-free wire bonding of microelectronic devices Impact-free wire bonding of microelectronic devices

1997-06-09

1999-03-23

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438 25, 438123, H01L 2144

Patent

active

058858938

ABSTRACT:
A stress-free and non-impact method of creating interconnects between electronic devices and electrodes is disclosed. A first conductive paste is deposited on one electrode. An electronic device, such as a dice, is attached to the electrode using the conductive paste. A second conductive paste is applied to the top surface of the dice and a third conductive paste is applied to another electrode. A conductive wire is deposited to the second and the third conductive paste. After curing, the two electrodes are connected to the dice. There is no impact required in creating the interconnect.

REFERENCES:
patent: 4209358 (1980-06-01), DiLeo et al.
patent: 4994412 (1991-02-01), Kalfus et al.
patent: 5338704 (1994-08-01), Imai et al.
patent: 5366692 (1994-11-01), Ogashiwa
patent: 5393705 (1995-02-01), Sonobe
patent: 5518957 (1996-05-01), Kim

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