Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-04-28
1994-09-20
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
622592, 16510433, 252 67, 257715, H05K 720
Patent
active
053494997
ABSTRACT:
A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.
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"Overheat Phenomena in Boiling Cooling", 1982 Autumn 43th Applied Physics Society Conference Proceeding, Sep. 28-30, p. 569, 29-F-3.
"Immersion Cooling for HIgh-Density Packaging", IEEE Transaction on Components, Hybrids, and Manufacture Technology, vol. CHMT-12, No. 4, Dec. 1987, pp. 643-646.
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"Cooling Technique for Semiconductor Element", Semiconductor Integrated Circuit Techniques 24th Symposium Conference Papers, Jun. 2-3, pp. 30-35.
Kamehara Nobuo
Niwa Koichi
Yamada Mitsutaka
Yokouchi Kishio
Fujitsu Limited
Tolin Gerald P.
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