Immersion cooling coolant and electronic device using this coola

Details Immersion cooling coolant and electronic device using this coola Immersion cooling coolant and electronic device using this coola

1993-04-28

1994-09-20

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

622592, 16510433, 252 67, 257715, H05K 720

Patent

active

053494997

ABSTRACT:
A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

REFERENCES:
patent: 3741292 (1973-06-01), Aakalu et al.
patent: 4303536 (1981-12-01), Orfeo et al.
patent: 4704658 (1987-11-01), Yokouchi et al.
1987 Proceedings 37th Electronic Components Conference; May 11-13, 1987; Immersion Cooling High Density Packaging; Kishio Yokouchi, Nobuo Kamehara; and Koichi Niwa, pp. 545, 549.
"Cooling Computers by Direct Immersing LSIs Liquid", Nikkei Electronics, No. 425, Jul. 13, 1987, pp. 167-176.
"Overheat Phenomena in Boiling Cooling", 1982 Autumn 43th Applied Physics Society Conference Proceeding, Sep. 28-30, p. 569, 29-F-3.
"Immersion Cooling for HIgh-Density Packaging", IEEE Transaction on Components, Hybrids, and Manufacture Technology, vol. CHMT-12, No. 4, Dec. 1987, pp. 643-646.
"Studies on Immersion Cooling for High Density Packaging", ISHM '87 Proceedings, pp. 175-180.
"Cooling Technique for Semiconductor Element", Semiconductor Integrated Circuit Techniques 24th Symposium Conference Papers, Jun. 2-3, pp. 30-35.

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