Imide epoxy resin composition for sealing semiconductor elements

Details Imide epoxy resin composition for sealing semiconductor elements Imide epoxy resin composition for sealing semiconductor elements

1993-01-06

1993-11-30

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 525476, 525481, 525482, 525484, 525485, 525486, 525487, 525488, 528 96, 549551, 549553, C08G 5926, C08G 5932, C08G 7306, C08G 7310

Patent

active

052666123

ABSTRACT:
An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical,

REFERENCES:
patent: 5189082 (1993-02-01), Kim et al.

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