Imaging device and method of manufacture

Details Imaging device and method of manufacture Imaging device and method of manufacture

2007-01-02

2007-01-02

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S057000, C438S064000

Reexamination Certificate

active

10284248

ABSTRACT:
An imaging chip is packaged in transparent injection molded material. The chip may have photosensitive elements arranged in a two-dimensional array on semiconductor material. Each element corresponds to a pixel of an image. The package may be formed of epoxy resin. In one aspect of the invention, the transparent plastic material provides a color filter. Second and third packages with complementary color filters may be used to provide signals for a color imaging system. In another aspect of the invention, a lens is integrated into the plastic package. In another aspect of the invention, a semiconductor chip is applied to a pre-formed plastic package by bump bonding.

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“A Pre-Molded Plastic Package for Polaroid CCD Devices,” MicroNews, Third Quarter 1997, vol. 3, No. 3.

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