Imaging device and manufacturing method for imaging device

Details Imaging device and manufacturing method for imaging device Imaging device and manufacturing method for imaging device

2007-02-06

2007-02-06

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

Reexamination Certificate

active

10414158

ABSTRACT:
An imaging device unit comprises a CCD chip and a substrate on which the CCD chip is soldered. A light receiving surface is provided in the front surface of the CCD chip. A dustproof member for protect the light receiving surface from dust is attached around the light receiving surface. Chip terminals are arranged between the light receiving surface and the dustproof member. When the CCD chip is pressed against the rear surface of the substrate, the dustproof member is elastically deformed and tightly makes contact with the substrate. Since ultrasound is applied to the chip terminals and the substrate terminals in this state to melt them, the CCD chip is positioned in parallel with the substrate. Upon stopping ultrasound horns, both of the terminals are immediately soldered to each other, so that the CCD chip is securely fixed on the substrate with ease.

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