Imager module packaging having top and bottom glass layers

Details Imager module packaging having top and bottom glass layers Imager module packaging having top and bottom glass layers

2008-07-02

2010-10-05

Luu, Thanh X (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C257S432000

Reexamination Certificate

active

07807960

ABSTRACT:
An imaging device module includes a circuit mounting layer; a bottom glass layer disposed above the circuit mounting layer; a silicon die disposed above the bottom glass layer; a top glass layer disposed above the silicon layer; and a lens holder disposed above the top glass layer. The silicon die includes an image sensor. The lens holder contains an optical component.

REFERENCES:
patent: 2004/0262705 (2004-12-01), Izumi et al.
patent: 2006/0043555 (2006-03-01), Liu
patent: 2007/0052050 (2007-03-01), Dierickx
patent: 2007/0241273 (2007-10-01), Kim et al.

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