Image transfer process for thin film component definition

Details Image transfer process for thin film component definition Image transfer process for thin film component definition

2007-10-10

2008-12-16

McPherson, John A. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S320000, C430S330000

Reexamination Certificate

active

07465532

ABSTRACT:
A method for fabricating a thin film component according to one embodiment comprises forming a wafer having a thin film layer, a release layer, and a patterned layer of photoresist; transferring the pattern of the layer of photoresist to the release layer and the thin film layer; adding a layer of metal to the wafer; heating the wafer to a predetermined temperature for a period of time sufficient to cause deformation of the photoresist to an extent that the photoresist creates cracks in the metal layer; applying a solvent to dissolve at least a portion of the release layer, the solvent penetrating the cracks in the metal layer to reach the release layer; and removing the release layer and any portions of the layers above the release layer.

REFERENCES:
patent: 7297470 (2007-11-01), Cornwell et al.
patent: 2005/0147924 (2005-07-01), Cornwell et al.
patent: 2001-344711 (2001-12-01), None

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