Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2008-03-18
2008-03-18
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C257SE21043
Reexamination Certificate
active
07344964
ABSTRACT:
An image sensor includes: a first impurity region of the first conductive type aligned with one side of the gate structure and extending to a first depth from a surface portion of the semiconductor layer; a first spacer formed on each sidewall of the gate structure; a second impurity region of the first conductive type, aligned with the first spacer and extending to a second depth that is larger than the first depth from the surface portion of the semiconductor layer; a second spacer formed on each sidewall of the first spacer; a third impurity region of the first conductive type aligned with the second spacer and extending to a third depth that is larger than the second depth from the surface portion of the semiconductor layer; and a fourth impurity region of a second conductive type beneath the third impurity region.
REFERENCES:
patent: 6372591 (2002-04-01), Mineji et al.
Lim Youn-Sub
Park Jae-Young
Blakely & Sokoloff, Taylor & Zafman
Geyer Scott B.
Magna-Chip Semiconductor, Ltd.
Ullah Elias
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