Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2011-02-22
2011-02-22
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S432000, C257S434000, C257S680000, C257SE23128, C257SE21002, C438S116000
Reexamination Certificate
active
07893514
ABSTRACT:
An image sensor package, a method of manufacturing the same, and an image sensor module including the image sensor package are provided. In the image sensor package, an image sensor chip is installed onto a depression of a transmissive substrate. An adhesive bonds the image sensor chip to the transmissive substrate and seals an Active Pixel Sensor (APS) on the image sensor chip, protecting it from fine particle contamination. An IR cutting film is disposed on the transmissive substrate to minimize the height of the image sensor package. The image sensor package is electrically connected to external connection pads in the depression. Consequently, the image sensor package has a minimum height, is not susceptible to particle contamination, and does not require expensive alignment processes during manufacturing.
REFERENCES:
patent: 5930610 (1999-07-01), Lee
patent: 6900429 (2005-05-01), Bai et al.
patent: 7227236 (2007-06-01), Lee et al.
patent: 7525167 (2009-04-01), Shizuno
patent: 2002/0043720 (2002-04-01), Nakamura
patent: 2002/0093078 (2002-07-01), Paek
patent: 2004/0211882 (2004-10-01), Hsieh et al.
patent: 2005/0051859 (2005-03-01), Hoffman
patent: 2005/0258518 (2005-11-01), Yang et al.
patent: 2006/0016973 (2006-01-01), Yang et al.
patent: 2007/0054419 (2007-03-01), Paik et al.
patent: 2007/0241273 (2007-10-01), Kim et al.
patent: 2008/0048097 (2008-02-01), Chen et al.
patent: 2001-358997 (2001-12-01), None
patent: 2003-0091389 (2003-12-01), None
patent: 20050093752 (2005-09-01), None
patent: 2005-0120359 (2005-12-01), None
English language abstract of Japanese Publication No. 2001-358997.
English language abstract of Korean Publication No. 2003-0091389.
English language abstract of Korean Publication No. 2005-0093752.
English language abstract of Korean Publication No. 2005-0120359.
Jang Hyung-Sun
Kang Un-Byoung
Kwon Woon-Seong
Kwon Yong-hwan
Lee Chung-Sun
Joy Jeremy J
Muir Patent Consulting, PLLC
Samsung Electronics Co,. Ltd.
Smith Zandra
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