Image sensor package and method of manufacturing the same

Details Image sensor package and method of manufacturing the same Image sensor package and method of manufacturing the same

2011-01-04

2011-01-04

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000

Reexamination Certificate

active

07863702

ABSTRACT:
An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.

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patent: 1408176 (2003-04-01), None
patent: 2002-0071475 (2002-09-01), None
English language abstract of the Korean Publication No. 2002-0071475.

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