Image sensor package and camera module utilizing the same

Details Image sensor package and camera module utilizing the same Image sensor package and camera module utilizing the same

2011-03-29

2011-03-29

Whipkey, Jason (Department: 2622)

Television

Camera, system and detail

Support or housing

C257S434000

Reexamination Certificate

active

07916212

ABSTRACT:
An image sensor package includes an image sensor chip, a sidewall, an encapsulation glass, conductive material, and a plurality of solder balls. The image sensor chip comprises a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area. The sidewall is located on the non-photosensitive are and defines a plurality of first through holes aligned with and corresponding to the bonding pads. The encapsulation glass is located on the sidewall. A plurality of solder balls are formed on the encapsulation glass aligned with the bonding pads, respectively. The encapsulation glass defines a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball. The image sensor package further comprises a conductive material through which the first and second through holes penetrate.

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