Television – Camera – system and detail – Solid-state image sensor
Reexamination Certificate
2011-04-19
2011-04-19
Ye, Lin (Department: 2622)
Television
Camera, system and detail
Solid-state image sensor
C250S208100
Reexamination Certificate
active
07929033
ABSTRACT:
An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.
REFERENCES:
patent: 6798053 (2004-09-01), Chiu
patent: 7498606 (2009-03-01), Street et al.
patent: 2004/0189854 (2004-09-01), Tsukamoto et al.
patent: 2004/0198854 (2004-10-01), Takahata et al.
patent: 2004/0251509 (2004-12-01), Choi
patent: 2006/0027740 (2006-02-01), Glenn et al.
patent: 2006/0091487 (2006-05-01), Hanada et al.
patent: 2006/0219862 (2006-10-01), Ho et al.
patent: 2007/0166955 (2007-07-01), Noma
patent: 2007/0292127 (2007-12-01), Kuhmann et al.
Lee Chi-Kuei
Wu Ying-Cheng
Diep Trung
Hon Hai Precision Industry Co. Ltd.
Ma Zhigang
Ye Lin
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