Image sensor monitor structure in scribe area

Details Image sensor monitor structure in scribe area Image sensor monitor structure in scribe area

2011-03-29

2011-03-29

Ngo, Ngan (Department: 2893)

Semiconductor device manufacturing: process

With measuring or testing

C438S015000, C438S017000, C438S018000, C257S048000, C257SE21521, C257SE23179, C257SE21524

Reexamination Certificate

active

07915056

ABSTRACT:
A semiconductor die including a semiconductor chip and a test structure, located in a scribe area, is designed and manufactured. The test structure includes an array of complementary metal oxide semiconductor (CMOS) image sensors that are of the same type as CMOS image sensors employed in another array in the semiconductor chip and having a larger array size. Such a test structure is provided in a design phase by providing a design structure in which the orientations of the CMOS image sensors match between the two arrays. The test structure provides effective and accurate monitoring of manufacturing processes through in-line testing before a final test on the semiconductor chip.

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